As an Equipment Engineer Intern at NXP, I led the design and validation of a 3D-printed camera mount in AutoCAD and ANSYS, reducing tool load time by 77% and significantly increasing manufacturing throughput. I also coordinated component sourcing with third-party vendors, balancing cost, lead time, and product quality to keep projects on schedule. I supported factory-wide improvements by standardizing installation procedures for new hardware across 24 semiconductor tools, reducing downtime and improving maintenance consistency.
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Highlights
Designed and validated a 3D-printed camera mount, reducing tool load time by 77%.
Coordinated component sourcing with third-party vendors.
Standardized installation procedures for new hardware across 24 semiconductor tools.